Electroless Copper Plating on a Cotton Surface: Effect of Metal Ion Ligand Stability Constant on Reduction Deposition

Electroless plating facilitates the metallization of nonconductive substrate surfaces, and of note, the precise control of the bath stability constant influences the deposition process of metal particles. In this paper, trisodium citrate, potassium sodium tartrate, nitrogen triacetic acid, thiourea, and ethylenediamine tetraacetic acid disodium were selected as coordination agents, and the effect of the metal ion ligand stability constant on the reduction deposition was studied. Coordination bonds can be established between the Cu