N‐polar deep‐recess GaN MISHEMT with enhanced ft·LG by gate dielectric thinning

The authors report a novel structure to improve the high‐frequency performance of nitrogen‐polar GaN deep‐recess high electron mobility transistors (HEMTs) wherein a timed plasma etch was used to tailor the profile of the gate dielectric. A favourable trade‐off between gate fringing capacitance and transconductance was established, resulting in an improved current gain cutoff frequency times gate length ( f t ·L G ) figure of merit compared to standard Schottky‐gate and metal‐insulator‐semiconductor (MIS) HEMTs. The etched gate dielectric MISHEMT demonstrated a maximum f t ·L G of 15.0 GHz·µm for an L G of 100 nm.