Enhanced Adhesion and Resolution of Negative Photoresists on Copper Substrates with Polyglycerin-Based Methacrylate

This study presents an investigation into the use of polyglycerin-based methacrylate (PGMA) as a component of negative photoresists to enhance adhesion and resolution on copper substrates. Polyglycerin, characterized by its polyol structure without quaternary carbon, offers excellent flexibility compared to conventional (meth)acrylates, which often suffer from reduced substrate adhesion due to stress during the curing process. By adding polyglycerin-based multifunctional methacrylates into the photoresist formulation, we exhibited significant improvements on both adhesion to copper substrates and the resolution of resist patterns. The effects of various PGMA derivatives on the photoresist performance were evaluated through a series of experiments, highlighting the potential of PGMA for advanced microfabrication applications.