Here we demonstrate fast selective laser‐induced etching (SLE) process with three‐dimensional (3D) hologram optics to reduce display bezel thickness with cost effective methods. To apply fast SLE for display manufacturing, one‐side etching process should be presumed to protect display active area. We developed one‐side selective laser‐induced etching with asymmetric 3D hologram laser beam satisfying with commercial mechanical strength. Faster etch process having etch rate 10 µm/min than common SLE, 1~3 µm/min was developed. Furthermore, we achieve that bezel thickness is 100 µm shorter than wheel scribing and CNC grinding.
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Kim et al. (2024) studied this question.
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