In recent years, micro‐LED technology has become crucial for high‐definition AR/VR displays and large TVs. ENJET addresses production challenges with a specialized bonder machine, employing EHD Printing, 1‐by‐1 transfer for precise, defect‐free micro‐LED production. This work demonstrated dispensing up to 7 µm conductive bond dots via EHD inkjet printing, achieving a placement precision of 1.5 µm in both x and y directions.
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Nguyen et al. (2024) studied this question.
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