Embedded cooling method with monolithic dual-layer microchannel cold plate for high-power chips

Driven by the demands of the intelligent industry, the thermal management of high power chips is causing huge concern. In the last several decades, microfluidic cooling has demonstrated great potential in device cooling applications. This paper presents a monolithically integrated manifold microchannel cold plate that can become a general embedded cooling method for most chips. The test samples are fabricated by the MEMS process and test. The experimental result shows that the cold plate can remove more than 500W/cm 2 heat with a thermal resistance below 0.25 K•cm 2 /W and the global average convective heat transfer coefficient was approximately 43300 W/m 2 •K. This approach is important for solving thermal management challenges in electronic devices.