Design and Fabrication of Embedded Microchannel Cooling Solutions for High-Power-Density Semiconductor Devices

The rapid development of high-power-density semiconductor devices has rendered conventional thermal management techniques inadequate for handling their extreme heat fluxes. This manuscript presents and implements an embedded microchannel cooling solution for such devices. By directly integrating micropillar arrays within the near-junction region of the substrate, efficient forced convection and flow boiling mechanisms are achieved. Finite element analysis was first employed to conduct thermo–fluid–structure simulations of micropillar arrays with different geometries. Subsequently, based on our simulation results, a complete multilayer microstructure fabrication process was developed and integrated, including critical steps such as deep reactive ion etching (DRIE), surface hydrophilic/hydrophobic functionalization, and gold–stannum (Au-Sn) eutectic bonding. Finally, an experimental test platform was established to systematically evaluate the thermal performance of the fabricated devices under heat fluxes of up to 1200 W/cm2. Our experimental results demonstrate that this solution effectively maintains the device operating temperature at 46.7 °C, achieving a mere 27.9 K temperature rise and exhibiting exceptional thermal management capabilities. This manuscript provides a feasible, efficient technical pathway for addressing extreme heat dissipation challenges in next-generation electronic devices, while offering notable references in structural design, micro/nanofabrication, and experimental validation for related fields.