Low temperature curable polyimides with good process compatibility and minimal device damage have been developed for 3D stacking hybrid bonding technology. Polyimide-to-polyimide bonding and copper/polyimide hybrid bonding at a low temperature curing were successfully demonstrated. Furthermore, polyimide-to-polyimide bonding mechanisms were investigated from the chemical and physical aspects of the material, respectively. Finally, polymer hybrid bonding with copper protrusion test vehicles were successfully polished with Chemical Mechanical Polishing, which showed good polyimide-to- polyimide and copper-to-copper joints.
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Nomura et al. (2024) studied this question.
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