Water Permeation Behavior in Polyimide Materials for Polymer Hybrid Bonding

Low-temperature processable polyimide was prepared for 3D stacking polymer hybrid bonding technology. The material has confirmed its reliabilities for semiconductor dielectric film and processabilities such as chemical mechanical polishing. Furthermore, gas permeability of the polyimide film was measured by a differential pressure method. Moreover, the amount of water vapor that can be permeated through insulating layer during the annealing process was estimated. Finally, a series of tests confirmed that water vapor released from the bonded chip.