Extremely Advanced Substrate as an integrated Package Solution (iPaS) for Next Generation High Performance Computing (HPC) applications

We have developed an extremely advanced substrate using polymer aluminum electrolytic capacitor technologies, which we call integrated Package Solution, or iPaS. This technology has high capacitance density (4.0 μF/mm 2 for the effective area) and built-in Plating Through Holes (PTHs) into capacitor array. Using iPaS, low-impedance for power delivery network can be achieved without other SMD-type components. As a result of prototyping, we confirmed high capacitance and low impedance with high quality. We propose to apply iPaS for power supply module board and semiconductor package substrate for high current density systems like High Performance Computing (HPC). We believe that this result contributes to realization of next generation power topologies such as vertical power delivery (VPD) or integrated voltage regulator (IVR).