Photonic integrated circuits (PIC) devices are impacted by fabrication tolerances and therefore, prior knowledge of such variation could improve the PIC fabrication process and overall yield. This paper presents a method for predicting the fabrication impacts on a telecommunication optical digital to analog converter (oDAC) based pulse amplitude modulator level four (PAM-4) transmitter. Our findings allow us to estimate the production yield in fabrication scenario using symbol error rate (SER) benchmark.
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Abejide et al. (2024) studied this question.
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