Efficient Investigation of Coupled Lines in Quasi Periodical High-Density Signal Routings for HPC Applications

In this paper, a method for efficient and rigorous analysis of cross coupling in a very dense periodical arrangement of signal lines in re-distribution layers of silicon-based interposers is presented. The proposed method reduces the calculation in a complex multi-conductor and multilayer structure to a very small number of time-consuming field calculations. Some examples related to a polymer-based silicon interposer showing the nature of the aggressor's field propagation through neighboring traces depending on the position of the aggressor and victim conductors are presented. Very good correlation between the proposed method and commercial fields solvers such as CST are obtained.