This special issue of IEEE Micro is devoted to selected top-pick articles presented at Hot Chips 2023. The Hot Chips Conference serves as a leading venue for presenting the technical details of innovative microchips on a wide range of topics, including computing, memory, interconnection, and cooling technologies. This particular issue features articles from AMD, Intel, UC Berkeley, Samsung, Cerebras, and Fabric8Labs on different topics including server CPUs, photonic interconnects, processing-in-memory, and artificial intelligence accelerators, as well as new cooling technologies.
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Litz et al. (2024) studied this question.
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