Mold Flow Strategy Improvement for Power Module

Power module market has grown significantly in recent years. In the power module structure, thicker mold thickness, wire diameter and higher arc height are required. However, during the actual production process, there are different influencing factors that lead to some production defects, such as short shots, voids and wire sweep, etc. For the purpose of improving product reliability, it is necessary to take some effective methods to reduce such production defects. The main purpose of this research is to use the mold flow tool to predict the racing effects and encapsulation problems of epoxy molding compound (EMC) caused by different product geometry, processing conditions and material properties during the molding process and offer an optimal solution for power module. By changing the gate layout, position and materials, we can effectively reduce void defects and wire sweep percentage during the molding process.