Cooling Performance Evaluation of Microprocessor Package and Heat Sink

To enable high performance microprocessor, both microprocessor's package thermal resistance and heat sink thermal resistance need to be lower. Thus, high thermal conductive materials are being developed by material manufacturers. This paper breaks down the effect of each material as thermal resistances, by utilizing 3D heat conduction simulation. Especially, the effect of TIM2 thermal conductivity is investigated as an example. After that, thermal test environment is prepared to obtain thermal impedance distribution of whole heat transfer path.