Solder Joint Reliability Comparison Under JEDEC Drop and System-Like Drop Test Conditions

The desire for consumer electronics such as handheld and wearable devices, along with Internet-of-Things (IoT) gadgets like smart TVs, speakers, and toys, has surged significantly in recent times and continues to expand. Concurrently, drop shock failure emerges as a prevalent and crucial issue for these handheld and portable electronic devices. In this study, a computational model is developed to evaluate the solder joint stress of the WLCSP under both JEDEC drop and system-like drop conditions. Subsequently, Taguchi experiments are conducted to assess the impact of three control factors on solder joint stress post system-like drop testing: (1) die thickness, (2) PI elastic modulus, and (3) PCB elastic modulus. Ultimately, the findings from the Taguchi analysis guide the identification of the optimal packaging design that effectively minimizes solder joint stress in the WLCSP package.