In this work, we present a D-band antenna module with a flat-top radiation pattern for mm-wave wireless systems. The module includes a perforated low- temperature co-fired ceramics (LTCC) Gradient-Index (GRIN) lens and a uniform planar array (UPA) of silicon resonator antennas integrated with active RFIC in Fan-out wafer level packaging (FOWLP). The FOWLP antenna-in-packaging (AiP) comprises 16 silicon resonator antennas fed by four 8 Multiplier chains in 28-nm FDSOI CMOS. The peaked realized gain of the AiP is 14.8 dBi and the Multiplier operation band is from 152.8 GHz to 165.8 GHz. The LTCC-based GRIN Lens is designed to convert the sharp beam of the AiP to the desired flat-top radiation pattern. The simulation and primary measurement results validate the performance of the proposed antenna module.
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Bahrami et al. (2024) studied this question.
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