Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer Packaging

To solve the problem of high dielectric loss of glass in mm-W/THz bands, we proposed two types of low-cost and low-loss air-filled transmission lines based on advanced glass wafer packaging. They are the air-filled double-sided gap waveguide (DS-GWG) and post-wall waveguide (PWWG). It is verified that those two solutions have excellent transmission performance in the mm-W band. The low-loss and low-cost characteristics can also be realized in the THz band because of the high-precision glass wafer packaging.