An Efficient Transient Electro-Thermal Coupling Analysis for System-in-Package

Electromagnetic pulse (EMP) consequentially induces signal interference and electro-thermal effects in system-in-package (SiP) products, thereby impacting their operating reliability. This research involves solving Maxwell's equations to delineate the electromagnetic field and its mutual interaction with the thermal field, incorporating Ohmic and dielectric losses as well as temperature-dependent material characteristics. The alternating direction implicit (ADI) method is utilized to bypass the stability restraint of the finite difference approach, and a time factor is introduced into the coupling process to harmonize their temporal discrepancies, thereby enhancing the simulation efficiency. Our algorithm enables the simulation of intricate models of electrical interconnects within SiPs. Transient coupling analysis is employed to evaluate the electrical performance variations over time and temperature, assessing the efficacy of the SiP design.