Thermal-Electromagnetic Co-Design of a Multi-Chip RF Front-End SiP with Embedded Microchannel Cooling

As integration density and performance demands continue to rise in modern radio frequency (RF) systems, system-in-package (SiP) architectures face growing challenges in managing both electromagnetic interference (EMI) and thermal dissipation. This study proposes a thermal-electromagnetic co-design approach for a multi-chip RF front-end SiP module based on a high-temperature co-fired ceramic (HTCC) substrate. The design integrates multi-cavity metallic shielding to suppress inter-chip EMI and embedded spider-netted microchannel networks to enhance liquid cooling efficiency. Unlike conventional solutions that require bulky heat sinks or external cold plates, the monolithically integrated microchannel network achieves high-efficiency heat removal with minimal spatial overhead. Both simulation and experimental validation confirm the effectiveness of the proposed approach, demonstrating significant improvements in thermal regulation, EMI suppression, and signal integrity. These findings provide a scalable design methodology for compact, high-power RF SiP modules in next-generation communication systems.