Synapse
⌘+K
Synapse
PulseExploreClubsResearchersJournals
Instagram
HomeClubsExplore
March 20, 2024IEEE Transactions on Power Electronics

A Comprehensive Design Method for Multichip Double-Sided Cooling Power Module With Multidimensional Self-and Mutual Inductances

View Full Paper
Ask AI
Bookmark
Share

Authors

JWJianing WangSYShaolin YuWZWeinan Zhou

Discussion

Loading...

Member takes

Overview

Key Points

Key points are not available for this paper at this time.

Cite This Study

Wang et al. (2024) studied this question.

synapsesocial.com/papers/68e732d9b6db6435876ac9fahttps://doi.org/10.1109/tpel.2024.3378683
View Full Paper
Ask AI
Bookmark
Share

Also Consider

Synapse has enriched 4 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Layout-Dominated Dynamic Current Imbalance in Multichip Power Module: Mechanism Modeling and Comparative Evaluation2019 · 96 citations
  2. 2Estimation, Minimization, and Validation of Commutation Loop Inductance for a 135-kW SiC EV Traction Inverter2019 · 68 citations
  3. 3A Double-End Sourced Wire-Bonded Multichip SiC MOSFET Power Module With Improved Dynamic Current Sharing2017 · 89 citations
  4. 4Electrical Performance Advancement in SiC Power Module Package Design With Kelvin Drain Connection and Low Parasitic Inductance2018 · 103 citations