Progress in resolving mask making challenges to enable HVM curvilinear patterning

The use of Inverse Lithography (ILT) in semiconductor manufacturing has been driving the need for curvilinear (CL) mask shapes. Complex CL mask shapes lead to an explosion in the vertex density (vertices/um^2) and file size at the mask shop vs. Manhattan corrections. This talk will review mask SEM CD and AIMS measurements from EUV and DUV masks made with end-to-end CL corrections (OPC, MPC and other mask CD corrections) at Intel mask operations (IMO). A path for significant file size reduction with the new MULTIGON record extension to the P39 OASIS file format will be reviewed. MULTIGON insertion involves significant changes in the mask making ecosystem that includes electronic tool design (EDA) tools, MBM writers and inspection tools. The talk will review the status of MULTIGON readiness and insertion at Intel.