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April 1, 2024Journal of Adhesion Science and Technology

An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints

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Authors

YLYang LiuXXXin XuYXYuxiong Xue

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Cite This Study

Liu et al. (2024) studied this question.

synapsesocial.com/papers/68e70edbb6db643587687cfahttps://doi.org/10.1080/01694243.2024.2336177
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Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Incorporating Tensile Stress into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints2024 · 1 citations
  2. 2Electromigration behaviour of solder joints under high current load: A review2026 · 3 citations
  3. 3Aging Effects on SAC305 Solder Joints: Correlating IMC Evolution, Hardness, and Drop-Shock Performance in ENIG and Immersion Tin Finishes2026
  4. 4Electromigration Kinetics of SAC/SnBiAg Hybrid Solder2024 · 1 citations
  5. 5Aging Effect on IMC Evolution in Bi-Based and SAC Soldering Pastes on 3D-Shaped Aluminum Cores2026