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August 9, 2024Journal of Electronic Packaging

Incorporating Tensile Stress into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

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WVWhit VinsonDHDavid Huitink

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Vinson et al. (2024) studied this question.

synapsesocial.com/papers/68e5cdb7b6db643587563eb2https://doi.org/10.1115/1.4066014
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Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints2024 · 5 citations
  2. 2Electromigration behaviour of solder joints under high current load: A review2026 · 3 citations
  3. 3Electromigration in Eutectic Gold-Tin (80Au20Sn-wt%) Solder Joints2025
  4. 4Aging Effects on SAC305 Solder Joints: Correlating IMC Evolution, Hardness, and Drop-Shock Performance in ENIG and Immersion Tin Finishes2026
  5. 5Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint2024 · 3 citations