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This is a Experimental Study study.

Electromigration in Eutectic Gold-Tin (80Au20Sn-wt%) Solder Joints

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Experimental analysis reveals reduced durability of solder joints under high current density and temperature conditions.

Electromigration significantly impacts the lifetime of eutectic gold-tin solder joints, reducing durability.
Results showed that only seven out of thirty-six test coupons survived the maximum duration of 500 hours.
Temperature and current density increase are correlated with a decrease in time to electromigration failure.
Post-failure analysis of the joints revealed critical morphological changes under electromigration conditions.

Vinson et al. (2025) studied this question.

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