23‐2: Invited Paper: Fabrication of Super Uniform Nickel Bumps Using Electroless Plating on Micro‐LEDs’ TFT Driver Substrates

In this study, in order to achieve high‐yield Micro‐LED chip bonding and thus further advance the breakthrough of Micro‐LED interconnect technology. In this study, an electroless plating method is used to achieve the highly uniform nickel bump arrays on thin film transistor (TFT) driver substrate. Initially, the photoresists AZ4620 and AZ2070 are chosen for the experiments, which can cover the step structure uniformly of TFT substrate. Subsequently, the morphology of bumps on the TFT substrate influenced by the plasma treatment and the deposition time is investigated. The 1% uniformity of the nickel bump arrays by the electroless plating for 30 minutes after 5‐minute plasma treatment is achieved, which lays the foundation for the electroless plating self‐bonding.