High speed wafer grooving with UV‐USP lasers

This article explores the application of ultraviolet ultrashort‐pulse (UV‐USP) laser grooving in tandem with other process steps such as plasma dicing as a practical approach to enable advanced microelectronic packaging. The non‐contact nature of UV‐USP laser grooving, along with its ability to ablate material with minimal lateral thermal damage, results in clean and precise grooving lines.