In this study, we investigated and characterized the combined process flow of the UV-USP (ultra-short pulse) laser grooving and plasma dicing wafer singulation technologies and discussed the impact on subsequent hybrid bonding steps. We benchmarked UV-USP laser grooving against UV-nanosecond laser grooving to enable plasma dicing by evaluation of imaging and die strength measurements. The results showed the advantages of the UV-USP laser grooving combined with plasma dicing for the current and future semiconductor production flows.
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Evertsen et al. (2024) studied this question.
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