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The use of lasers for Printed Circuit Board (PCB) manufacturing continues to grow as their cost-per-Watt goes down and power levels go up. Furthermore, many lasers now offer features such as temporal pulse tailoring, which is often beneficial. In this work, we demonstrate several PCB processes using UV and green high-power ns-pulse lasers. In addition to cutting thicker FR4, cutting of system in package (SiP) material is demonstrated, and a process using advanced temporal pulse tailoring with 100 W of UV single-mode laser power for percussion flex-PCB via-drilling is demonstrated for a ~50 μm hole diameter.
Hollister et al. (Tue,) studied this question.