23‐5: Application of Non‐Conductive Paste (NCP)‐assisted bonding for Interconnection between Micro‐LED and Backplane

Micro‐LED, as one of the most promising advanced display technologies, has attracted increasing research interest from academia and display industry. With the outstanding performance in brightness, lifetime, and contrast, Micro‐LED display shows tremendous potential for applications in various electronic terminals. The bonding between Micro‐LED and backplane is the key technology that affects the industrialization of Micro‐LED display at present. The common bonding technology can be classified as metal bonding and ACF bonding. Metal bonding has the advantages of low cost and high bonding strength. However, the bonding yield is affected by the difficulties of thermal mismatch and short circuit. In order to solve these difficulties, we developed a bonding process based on Non‐Conductive Paste (NCP). That is, the Micro‐LED transfer onto the backplane with a lay of NCP, then realizing the conductivity between the Micro‐LED and the backplane by thermocompression bonding. In this paper, we applied this technology in 180 × 160 pixels full‐color Micro‐LED display, and achieved more than 99.99% bonding yield by testing the NCP material characteristics, temperature and pressure.