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The current state of cryogenic cooling technology in electronics is reviewed, and prospects for the development of this area are estimated. Scientific papers published for a wide period of time were analyzed, and the main trends and problems have been identified based on the analysis results. The results obtained testify that cryogenic cooling will soon be introduced into power semiconductor technology. Primarily, the application field of the technology in question encompasses systems that already contain a cryogenic cooling loop. Expectedly, the use of cryogenic cooling can lead to a decrease in weight and an increase in the efficiency of power semiconductor converters provided that well-thought approach to their design is applied. This approach is possible if there is complete information about the characteristics of various electronic components at cryogenic temperatures. The main attention is paid to analyzing the practical significance of the investigations that have been carried out to date, and an attempt is made to answer the question of the possibility to obtain an economic gain when using this technology in various fields of electrical engineering.
Ostapchuk et al. (Wed,) studied this question.