This Paper mainly studies the influence of Foup Environment On Defects in Semiconductor manufacturing. The influence of the change of the interval environment of the foup on the wafer defects gradually appears with the continuous reduction of the semiconductor size. This paper focuses on introducing the defects related to the internal environment of the foup and the mechanism of the defect generation. Which factors in the mechanism are related to the environment. This Paper introduces two types of defects related to the internal environment of the foup.
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Zhao et al. (2024) studied this question.
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