With the advancements in 2.5/3D fabrication offered by Foundry Technologies for unleashing computing power, EDA tools must adapt and take a direction to be more integrated and IC centric for multi-chiplet system design. 3D stacking introduces extra design and analysis requirements like full system planning, power, thermal analysis, cross-die STA and inter-die physical verification which have to be taken into account early during planning and implementation. In this paper, Cadence presents its technology that proactively looks ahead through integrated early analysis and addresses all aspects of 3D-IC design comprehensively from system planning, implementation, analysis and system level signoff capabilities.
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Wang-Tyng Lay (2024) studied this question.
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