Enabling System Design in 3D Integration: Technologies and Methodologies

3D integration solutions have been called for in the semiconductor market for a long time to possibly substitute the place of technology scaling. It consists of 3D IC packaging, 3D IC integration, and 3D silicon integration. 3D IC packaging has been in the market, but 3D IC and silicon integrations have obtained more attention and care due to modern system requirements on high performance computing and edge AI applications. In the need of further integration in electronics system development at lower cost, chip and package design are therefore evolving along the years [11].