Enhanced robustness against hot-electron-induced degradation in active-passivation p-GaN gate HEMT

The hot-electron-related reliability is an important issue for GaN power devices under harsh operation condition or environment. These high-energy electrons can scatter toward the device surface or buffer layer, introducing newly generated traps/defects and resulting in the degradation of dynamic ON-resistance (RON). This work investigates the dynamic characteristics in active-passivation p-GaN gate HEMTs (AP-HEMTs) after hot-electron stress (HES). Unlike the dielectric passivation whose dynamic RON performance is often reported to severely worsen as hot-electron-induced defects/traps accumulate, the active passivation is found to have a superior robustness against hot-electron stress. In this study, after an HES of 30 min with VD = 200 V and IS = 10 mA/mm, the dynamic RON/static RON of a conventional HEMT increases dramatically from 3.63 to 9.35 for VDS-OFF = 650 V, whereas that of AP-HEMT only shows a slight increase from 1.51 to 1.85. Two mechanisms have been experimentally proved for the improved hot-electron robustness in AP-HEMT. (i) The mobile holes in active passivation layer can effectively screen the preexisting and/or newly generated surface defects/traps from affecting the 2DEG channel. (ii) The recovery of buffer trapping is accelerated by hole injection from gate and active passivation.