Projection of Circuit Performance at Cryogenic Temperatures including Self-Heating: A Device-Circuit Co-design Perspective

This article explores an in-depth analysis of device performance at cryogenic temperature. A detailed analysis has been carried out to observe how the device metrics translate as we progress from device to circuit level. Strong-Arm Latch comparator and ring oscillator have been used for analysing performance trends at circuit-level implementation. The effect of self-heating phenomenon has been explored all the way from room temperature to cryogenic range. This study has pointed out probable area/hardware overheads required for efficient circuit design at cryogenic temperatures.