Semiconductor device performance is impacted by variations in the manufacturing process. Modeling of such variations in the design process and accounting for their impact on chip timing and electrical specs is key to ensuring high yielding parts post manufacturing. Circuits created with multiple transistor types require to comprehend the interdependencies between variations of different transistors. In this paper we discuss about challenges related to handling of such variations in design closure process of integrated circuits involving multiple transistor types.
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Ajoy Mandal (2024) studied this question.
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