As compute density continues to grow to meet emerging cloud and AI workload demands, total compute current requirements are increasing to the point where power delivery is an important bottleneck to the overall system performance. This is further exacerbated by the recent use of 2.5D and 3D advanced packaging techniques, which tend to worsen input- and output load lines, leading to higher voltage margin requirements and lower system efficiency.
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Butzen et al. (2024) studied this question.
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