Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders

Sn-Ni system alloys are promising alternatives to replace Sn-Pb alloys as they exhibit high corrosion resistance and good weldability. However, Sn-Ni alloys still have low mechanical strength and low reliability. Using the strategy of the addition of alloying elements can be a way to improve the properties of Sn-Ni alloys. Zinc (Zn) plays an essential role in the lead-free solder alloys sector by mitigating the growth of intermetallic compounds in soldered joints, refining the microstructure, enhancing the mechanical strength, and ultimately reducing the overall cost. This study aims to explore the impacts of Zn additions (0.2 and 0.5 wt %) on thermal parameters (growth rate-