A 0.75V 10nm FinField-Effect Transistor Based Hybrid Self Controlled PreCharge Free Content Addressable Memory for Low Standby Power Applications

The switching speed and driving capability have been enhanced by scaling the transistor size to nanoscale. The limitations in using MOSFET are that the short channel effects such as leakage current, subthreshold voltage, etc. thereby the Complementary Metal Oxide Semiconductor (CMOS) scaling is challenging now.This leads to the emergence of multi-gate devices, such as Fin Field Effect Transistor (FinFET) and Double Gate FinFET (DG-FinFET), which reduces the short channel effect. Now, a days memory plays a vital role in Integrated Circuits (IC), so the size of it must be scaled down to reduce the overall leakage andinstead of CMOS an advanced MOSFET such as FinFET can be used to avoid SCE. The area of the memory Static Random Access Memory (SRAM) is reduced by eliminating the two-load transistor. The novel 4T SRAM is designed at 10 nm 0.75 v FinFET Technology and compared with 14 nm Technology that is inbuilt into content addressable memory (CAM) to reduce the power consumption of CAM. The results show that the proposed design improves on a voltage basis and the complexity of the circuit is reduced by about 23% in terms of transistor count compared with the other conventional techniques. The 10 nm FinFET Hybrid Self Controlled - PreCharge Free (HSCPF) CAM design is best-suitable for low-power applications.