High‐Temperature Piezoresistive Body‐Mounted Sensor Featuring Rigid and Flexible Interconnects

Against the background of the demand for highly flexible, highly sensitive and high temperature resistant strain sensors in aerospace and other fields, a new flexible and high temperature resistant strain sensing material was developed in this study. A highly cross‐linked three‐dimensional network structure is formed through the Michael addition reaction, which endows the material with excellent properties. Among them, the conductivity of BMI‐D2000‐graphene‐3% reaches 0.0021 S/cm; the tensile strain at break is 73%, the fracture stress is only 0.34 MPa, and the curves of 500 loading and unloading cycles basically overlap, with excellent fatigue resistance. Its initial decomposition temperature is 5°C–10°C higher than that of the pure matrix. The sensitivity of strain monitoring of this elastomer at room temperature and high temperature is GF≈0.639 and GF≈0.319, respectively, showing excellent stability.