Simulation establishes flow and temperature field models in PECVD, suggesting process parameters influence distribution.
The distribution of gas flow and temperature fields plays a crucial role in influencing the uniformity and deposition rate of PECVD (plasma enhanced chemical vapor deposition) coating deposition processes. This study establishes distribution models for the fluid and temperature fields within a PECVD chamber and analyzes the impact of process parameters and electrode spacing on the thermal flow field through simulation experiments. Under standard process conditions, a series of different simulation experiments was designed using the single-variable principle. The results show that under various process parameters, the characteristics of the flow field are well-maintained, with an approximately parabolic distribution of transverse flow velocities; temperature and pressure distributions exhibit minimal fluctuations. Due to the elevated gas temperatures near the vertical heating plate, a buoyancy-induced flow field forms in the reaction region. This flow field primarily affects the distribution of longitudinal velocities while having a smaller impact on the transverse velocity distribution.
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Li et al. (2025) studied this question.
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