Bioinspired Janus Microfluidic Heat Sink for Ultra‐Efficient CPU Cooling via Millisecond‐Scale Bubble Transport

Efficient thermal management is increasingly critical for high‐performance computing and emerging artificial intelligence hardware, where heat fluxes exceed the capabilities of conventional heat sinks. Here, a 3D‐printed bioinspired Janus microchannel heat sink is reported that enables ultrafast bubble transport and stable two‐phase cooling for electronic devices. Inspired by the Namib desert beetle, the heat sink integrates asymmetric wettability‐a superhydrophobic top surface and hydrophilic bottom surface‐creating a Laplace pressure‐driven pathway for millisecond‐scale bubble removal. This architecture suppresses vapor‐film formation, maintains continuous liquid replenishment, and achieves a critical heat flux (CHF) of 105 W cm −2 , representing an up to 125% improvement over conventional microchannel heat sinks. Integrated into a commercial CPU, the Janus microfluidic heat sink maintains maximum clock frequency under full load without thermal throttling, demonstrating a scalable material‐driven solution for next‐generation thermal management. This bioinspired approach establishes a platform for programmable surface functionality in high‐power electronics, with potential applications in data centers, electric vehicles, and aerospace systems.