Demonstrates a Si3N4-TFLN device optimizing phase modulation and frequency doubling in integrated systems, suggesting advances in optical communication.
Electro-optic phase modulation is a core technology for signal processing in optical communication and microwave photonics, yet the current multifunctional integrated devices for high-bandwidth phase modulation and efficient frequency doubling suffer from critical bottlenecks including large crosstalk, excessive chip area, bandwidth-voltage trade-off and single material performance limitations. To address these issues, this study proposes a Si₃N₄-TFLN heterogeneous integrated design scheme by synergizing the low-loss property of silicon nitride and the strong electro-optic effect of thin-film lithium niobate. A dual-drive Mach-Zehnder modulator (DD-MZM) and a racetrack micro-ring resonator (MRR) with high quality-factor and large free spectral range are cascaded to realize the monolithic integration of high-precision phase modulation and microwave signal frequency doubling. Co-simulation results show that the designed device achieves an electro-optic modulation bandwidth of 72 GHz and a half-wave voltage-length product of 2.8 V·cm, which well reconciles the bandwidth-voltage trade-off. The device exhibits a frequency doubling efficiency of 15%, 30.4% higher than that of the single TFLN-based MRR. The cascaded coupling structure suppresses the functional crosstalk to -38 dB, and the total chip layout area is only 3.648 mm², over 60% smaller than that of the existing similar devices. This work provides a high-performance on-chip solution for high-density integrated systems in optical communication, microwave photonics and quantum information processing.
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Liu et al. (2026) studied this question.
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