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DARPA initiatives develop high-temperature sensors for precision monitoring in extreme conditions, improving efficiency.
The advancement of hypersonic propulsion, geothermal energy, and oil and gas exploration demands transistor and sensor technologies capable of operating in extreme thermal conditions. This talk presents high-bandwidth, high-dynamic-range electronics and sensing solutions developed under the DARPA HOTS program and SBIR initiatives, enabling precision instrumentation in environments up to 800°C. By leveraging recent breakthroughs in wide-bandgap semiconductors, piezoelectric transducer materials, and high-temperature analog integration techniques, the DARPA programs aim to demonstrate a compact, thermally hardened transistor and sensor platform with enhanced durability and performance. Innovative fabrication methodologies–including advanced layer transfer techniques and stress-optimized transistors–ensure robust operation without active cooling. These developments allow real-time dynamic pressure and thermal monitoring, as well as high-fidelity signal conditioning in hypersonic engines, deep geothermal wells, and high-temperature industrial processes, reducing uncertainty and optimizing system efficiency. Future work will focus on full-system integration and extended operational lifetime to support next-generation aerospace, energy, and defense applications.
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