Overcoming high-temperature performance limitations: Multidimensional design and innovation of thin-film thermocouples

Thin-film thermocouples (TFTCs) are known for their thinness, low thermal mass, fast response time, and low interference with component structure and flow field. High-temperature sensors have become an essential technological area for high-temperature tests of advanced equipment such as aeroengines and hypersonic vehicles. This paper presents a systematic review of research advancements in high-temperature thin-film thermocouples (HT-TFTCs) across five core dimensions: material systems, structural design, fabrication processes, failure mechanisms and protection, and self-healing technologies. In addition, this paper outlines future development trends. In order to enhance the development of HT-TFTCs with long service life and high reliability, as well as intelligent applications, it is necessary to strengthen multi-dimensional collaborative design and integrated innovation, further promote self-healing technology with intelligent regeneration, and overcome performance limitations.