Discusses challenges in electrostatic discharge protection for advanced chiplet microsystems, indicating future research needs.
Heterogeneous integration opens a pathway to three-dimensional chiplet-based microsystem chips. Electrostatic discharge reliability is a major challenge to future smart chips featuring rich functionalities and ultra performance, utilizing advanced heterogeneous integration and packaging technologies. This paper discusses emerging challenges and future research directions in developing robust electrostatic discharge protection solutions for future systems-on-integrated-chiplets.
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Li et al. (2026) studied this question.
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