Phonon Thermal Transfer Analysis at Interface between Filler and Resin

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Key Points

This research aims to analyze the thermal transfer mechanisms at the interface between filler and resin in high-performance heat dissipation materials.
Visualized thermal conduction pathways using FIB-SEM observation.
Calculated interface thermal transfer coefficient (Tc) experimentally.
Conducted molecular dynamics (MD) analysis to compute Tc against a defined interface model.
Examined the relationship between surface treatment density/length and Tc.
Experimental and MD results for Tc matched within 10% difference, validating the MD analysis.
Identified optimal conditions for maximizing Tc based on density and length of molecular chains at the interface.
Demonstrated that steric hindrance limits the penetration of resin molecules at the interface.

This analysis investigates thermal transfer at the filler-resin interface, suggesting optimal conditions for thermal conductivity improvement.

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Arao et al. (2026) studied this question.

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