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Synergistic effects of thermal compression temperature and density on the self-bonding mechanism and properties of binderless bamboo scrimber

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Investigations reveal optimal bonding strength and moisture resistance in binderless bamboo scrimber via thermal compression.

To investigate the impact of thermal compression temperature and density on the self-bonding mechanism of bamboo scrimber.
Conducted systematic investigations on thermal compression parameters.
Utilized multi-scale characterization techniques including SEM and FTIR.
Assessed bonding strength, flexural performance, and moisture resistance.
Found that higher thermal compression temperatures improve self-bonding through enhanced lignin cross-linking.
Optimal bending properties achieved at 160 °C and 1.2 g/cm³ with maximum MOR and MOE.
Bonding and moisture resistance optimized at 170 °C and 1.2 g/cm³, highlighting a performance trade-off.

Wang et al. (2026) studied this question.

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