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Demonstrates enhanced performance of a low-noise transimpedance amplifier for AI data centers, suggesting increased efficiency in optical interconnects.
Addressing the stringent demands for high speed, low latency, and signal integrity in optical interconnects for AI data centers, this paper proposes a 25Gbps low-noise transimpedance amplifier (TIA) with a gain-enhancement technique, realized using 0.18[Formula: see text]m SiGe BiCMOS technology. Targeting the characteristics of high-density interconnection within AI clusters, this design effectively extends the bandwidth by employing the inductor peaking technique; the adjustable gain-enhancement technique is utilized to reduce the equivalent input noise, thereby ensuring the accuracy of massive model parameter transmission; a fast response is achieved through adaptive current extraction at the input to accommodate AI low-latency communication. Furthermore, it integrates a DC cancellation technique with feedforward and an Received Signal Strength Indicator (RSSI) circuit. A limiting amplifier incorporating a single-ended-to-differential conversion stage, followed by an output buffer, is cascaded in the back end. Test results show that the main TIA achieves a transimpedance gain of 62.6 dB[Formula: see text] and a -3dB bandwidth of 20.3 GHz; the equivalent input noise current is as low as 9.03 pA/ [Formula: see text] at a 25Gb/s operating rate, and the power consumption is only 63mW under 3.3V/1.8V supply voltages, making it suitable for large-scale parallel AI optical interconnect applications.
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Lai et al. (2026) studied this question.
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